Through-wafer Via Etch Throughput Improvement in a GaAs Semiconductor Device
نویسندگان
چکیده
At Skyworks Solutions throughput of the back side through-wafer via etch process was low because of a high rework rate. The high rework rate was due to an organic residue blocking the etch. A process was first developed to remove the residue and then integrated into the via etch process. The optimized via etch process resulted in a reduction in reworks and a significant increase in process throughput.
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تاریخ انتشار 2004